Electronic manufacturing services
- More than 4500 sq. m in two production sites. Head office in Saint Petersburg.
- Wide range of assembly services - PCB SMT, THT, PoP and BGA, PGA, and LGA etc. Reflow soldering in convection and vapor-phase ovens, selective soldering and hand mounting. PCB assembly using non-lead-free, lead-free and hybrid technologies.
- Complex ESD protection system
- All work places are equipped with antistatic devices, furniture and instruments
- Traceability system at all stages of production.
SMT assembly
- SMT PCB assembly of any level of complexity and volume, from prototypes and small batch production to mass production
- Several modern automated lines for SMT assembly
- Unique technology for PCBA SHF mass production. Operating frequency is 6, 12 or 24 GHz.
- Metal based PCB assembly
DIP assembly and Selective soldering
DIP assembly and selective soldering are carried out using modern equipment from leading manufacturers- SEHO, NACCO and ERSA.
BGA, µBGA, QFN, etc. reworking, BGA reballing.
Placement or removal of BGA, µBGA, QFN and other surface mount fine pitch components with repeatable solder reflow profiles. Automated BGA reballing. These services are performed using FinePlacer Core, Hakko and STM-II equipment.
